Technology : Optics

The state of the art of modern lightwave system design Recent advances in lightwave technology have led to an explosion of high-speed global information systems throughout the world. Responding to the growth of this exciting new technology, Lightwave Technology provides a comprehensive and up-to-date account of the underlying theory, development, operation, and management of these systems from the perspective of both physics and engineering. more...

Price: $106.95

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added. more...

Price: $123.00

Presents a variety of image analysis applications, reviews their precise mathematics and shows how to discretize them. Intended for the mathematical community, and the computer vision community, this work also provides an overview of the mathematics involved in image procesing problems. more...

Price: $69.95

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. more...

Price: $165.00

Contains initial boundary value problems that describe the transient electromagnetic fields formed by open periodic, compact, and waveguide resonators. This book provides an approach to scattering of transient fields. It is useful for scientists in applied mathematics, computer science and computational physics. more...

Price: $139.00